| IPC
boards are designed to assist a company in testing surface insulation resistance
(SIR). They can also be used to test for ionic contamination (conformal
coating), solderability (interaction of solder flux and solder paste), and
soldermask. |
The
final finish options vary depending on the criteria being tested. Finishes
include
bare copper, hot air solder level (HASL), gold fingers, SMOBC over bare
copper, immersion silver, immersion nickel/gold, and immersion tin. The
most commonly tested board is the IPC-B-24 with a bare copper finish.
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| A
clean board is vital to generate accurate testing results. Although dsi
cleans all boards for total ionics at 6mg/in² and seals the boards in vacuum
packed packages with desiccant, dsi recommends that the user
re-clean the boards prior to use in accordance with the testing parameters
to be performed. If the packaging has been opened or otherwise seems
to be compromised, the boards certainly should be re-cleaned prior to use. |
| IPC-B-24
Surface Insulation Resistance |
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This
single-sided (4-up) pattern is used for evaluating the interaction
of solder flux and solder paste residues on printed boards. This board
was used in the Phase 3 portion of the test program evaluating alternative
technologies used to eliminate CFCs in printed board assembly operations.
The board contains four comb patterns with 0.4 mm lines and 0.5mm
spaces.
View
Board | Order information
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| IPC-B-25-1
Multipurpose One-sided Test Pattern |
Referenced in
IPC-CC-830 and IPC-SM-840C. Primarily used for surface insulation
resistance testing.
View Board | Order information
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| IPC-B-25A
Multipurpose One-sided Test Pattern |
Artwork for standard
test boards as referenced in IPC-CC-830 and IPC-SM-840C. Primarily
used for surface insulation resistance for testing.
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| IPC-B-36
Cleaning Alternatives Artwork |
This double-sided
(with plated through-holes) board was developed to evaluate cleaning
alternatives to chlorofluorocarbons. It contains four 68 I/O chip
carrier sites and 10 SIR test points. It features 0.125 mm lines and
spaces.
Top View of Board | Bottom View Board | Order information
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| J-STD-001
Requirements for Soldered Electrical And Electronic Assemblies |
This double-sided
board (only) was developed for use with the J-STD-001 Training and
Certification Program on soldering test boards. The training includes
methods and verification criteria for producing high-quality solder
connects.
Order information
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| MIL-1-46058C-H
Insulating Compound, Electrical (For Coating Printed Circuit Assemblies) |
This singled-sided
board, sometimes referred to as the "Y" board, is a military
design for testing conformal coatings that are suitable for application
to printed circuit boards by dipping, brushing, spraying, or vacuum
deposition. This design was designated as inactive for new design
and is no longer used, except for replacement purposes (effective
11/03/98).
View Board | Order information |
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