RAPIDPROTO can produce any current technology and place every surface mount and through hole component, thanks to state-of-the-art equipment and software.
RapidProto relies on the in-house DIVSYS analytical lab to verify the initial quality of the PCB. Starting with a good board is the biggest piece of the puzzle. Lab insurance eliminates the most critical failure element in electronic assembly.
PCB LABThe incoming inspection process in our in-house testing lab to guarantees an ‘approval for use’
Test available :
Visual Inspection and cross section
Electric Bare Board Testing
3D X-RAY and X-RAY fluorescence
Solderability test and stress test
Ionic contamination and Ion chromatography
Differential scanning calorimetry
Time-domain reflectometer
SOLDER PASTE DISPENSINGThe process of dispensing the required quantity of solder paste in each location on each pads on the printed circuit boards.
Technologies available:
Jet paste printer (Minimum aperture 0.33mm)
Paste printing by stencil (Minimum aperture 0.15mm)
SURFACE MOUNT ASSEMBLYSurface-mount assembly is the technology in which the components are mounted directly onto the surface (Top or Bottom) of the printed circuit boards
Capabilities available :
Finest pitch lead: 0.25mm x 0.25 mm center
Smallest chip part: 01005
Largest part: 160mm x 160mm
Thickest board: 7mm
Largest Panel size: 18’’ x 23’’
BGA smallest pitch: 0.35mm
Package on package technology
THROUGH HOLE ASSEMBLYThrough-hole assembly is the technology in which the leads of the components are inserted into holes drilled in the printed circuit boards and then soldered.
Technologies available :
Selective solder
Manual solder
Capabilities available :
Solder: Lead free and Leaded
Flux: No clean and Aqueous
WASHINGThe post production process of cleaning the PCBA to remove the flux residues or other potential contaminants.
Technologies available :
Batch cleaning
COATINGThe process of applying a thin protective layer on the PCBA to protect against moisture, dust, chemicals, and/or extreme temperature.
Technologies available :
Automatic 5 axis coating machine
Capabilities available :
Urethane
Acrylic
Silicone
Parylene
DEPANELINGThe process of separating the individual PCBAs from the panel (PCB array)
Technologies available :
Routing
Vcut
Xray inspection
PCBA INSPECTIONThe post-production process of the PCBA to examine for potential failures occurring during the production process.
Technologies available :
2D AOI
3D AOI
Ionic contamination
Ion chromatography
Visual inspection according IPC A-610 class 2 or 3
REWORKThe manual or automatic process of desoldering and/or re-soldering of components due to production failure or design issue.
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