A quality solder fill on the topside of your PCB is a reward achieved by properly combining the necessary ingredients of the soldering operation.
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Time on Joint (TOJ) is not well documented in the literature for selective soldering. All solder operations require a minimum time for the tin-to-base metal intermetallic to properly form, and for the capillary action to pull the solder through the component hole.
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This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.
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