A quality solder fill on the topside of your PCB is a reward achieved by properly combining the necessary ingredients of the soldering operation.
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Time on Joint (TOJ) is not well documented in the literature for selective soldering. All solder operations require a minimum time for the tin-to-base metal intermetallic to properly form, and for the capillary action to pull the solder through the component hole.
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It seems that each generation of assemblers forgets how stencil prints work. In my consulting, I am being told more and more often that the stencil file is sent to the stencil maker with no accompanying guidelines. Or, if there are guidelines, they are generic and steeped in tribal knowledge.
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This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.
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