Program
Laminates choices and Proper selection
Surface Finishes and their Applications and Limitations
Via Structures and their uses
Copper plating and Understanding thickness
Cleanliness understanding the terms and the implications
Why does the bare board and the assembly have the same standard?
Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)
Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract