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WEBINARS
TECHNICAL WORKSHOPS
RapidProto holds advanced workshops focused on providing a detailed understanding of PCB and PCBA.
o RapidProto invites you to spend a day with our technical experts in PCB design, fabrication and assembly
The day includes three 45-minute technical presentations, a facility tour, breakfast, lunch and two workshops. Although the topics are technical in nature, they do not require technical knowledge. They are intended for participants from all disciplines, from Purchasing to Quality.
Our workshops are interactive and encourage client participation with questions and comments. We understand how busy our clients are, you are welcome to stay all day or just attend a presentation, workshop or specific topics of interest.
CALENDAR
Program
Laminates choices and Proper selection
Surface Finishes and their Applications and Limitations
Via Structures and their uses
Copper plating and Understanding thickness
Cleanliness understanding the terms and the implications
Why does the bare board and the assembly have the same standard?
Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)
Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract
Program
Laminates choices and Proper selection
Surface Finishes and their Applications and Limitations
Via Structures and their uses
Copper plating and Understanding thickness
Cleanliness understanding the terms and the implications
Why does the bare board and the assembly have the same standard?
Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)
Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract
Program
Laminates choices and Proper selection
Surface Finishes and their Applications and Limitations
Via Structures and their uses
Copper plating and Understanding thickness
Cleanliness understanding the terms and the implications
Why does the bare board and the assembly have the same standard?
Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)
Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract
Program
Laminates choices and Proper selection
Surface Finishes and their Applications and Limitations
Via Structures and their uses
Copper plating and Understanding thickness
Cleanliness understanding the terms and the implications
Why does the bare board and the assembly have the same standard?
Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)
Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract
Program
Laminates choices and Proper selection
Surface Finishes and their Applications and Limitations
Via Structures and their uses
Copper plating and Understanding thickness
Cleanliness understanding the terms and the implications
Why does the bare board and the assembly have the same standard?
Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application
Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers
Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)
Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)
Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract