WEBINARS
TECHNICAL WORKSHOPS
RapidProto holds advanced workshops focused on providing a detailed understanding of PCB and PCBA.  

o RapidProto invites you to spend a day with our technical experts in PCB design, fabrication and assembly

The day includes three 45-minute technical presentations, a facility tour, breakfast, lunch and two workshops. Although the topics are technical in nature, they do not require technical knowledge. They are intended for participants from all disciplines, from Purchasing to Quality.

Our workshops are interactive and encourage client participation with questions and comments. We understand how busy our clients are, you are welcome to stay all day or just attend a presentation, workshop or specific topics of interest.

CALENDAR

August 25th 2020 - DEL MAR

Program

Laminates choices and Proper selection

Surface Finishes and their Applications and Limitations

Via Structures and their uses

Copper plating and Understanding thickness

Cleanliness understanding the terms and the implications

Why does the bare board and the assembly have the same standard?

Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application

Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers

Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)

Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)

Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract

July 27th 2020 - SMTA

Program

Laminates choices and Proper selection

Surface Finishes and their Applications and Limitations

Via Structures and their uses

Copper plating and Understanding thickness

Cleanliness understanding the terms and the implications

Why does the bare board and the assembly have the same standard?

Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application

Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers

Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)

Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)

Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract

June 20th 2019 - INDIANAPOLIS

Program

Laminates choices and Proper selection

Surface Finishes and their Applications and Limitations

Via Structures and their uses

Copper plating and Understanding thickness

Cleanliness understanding the terms and the implications

Why does the bare board and the assembly have the same standard?

Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application

Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers

Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)

Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)

Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract

June 18th 2019 - LOS ANGELES

Program

Laminates choices and Proper selection

Surface Finishes and their Applications and Limitations

Via Structures and their uses

Copper plating and Understanding thickness

Cleanliness understanding the terms and the implications

Why does the bare board and the assembly have the same standard?

Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application

Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers

Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)

Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)

Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract

October 31th 2018 - INDIANAPOLIS

Program

Laminates choices and Proper selection

Surface Finishes and their Applications and Limitations

Via Structures and their uses

Copper plating and Understanding thickness

Cleanliness understanding the terms and the implications

Why does the bare board and the assembly have the same standard?

Laminate choices, glass transition temperature and lead-free compatibility, Conductive Anodic Filament Growth, Differential Scanning Calorimeter (DSC) application

Surface finishes (OSP, HASL, immersion silver and ENIG). Tin Whiskers

Via Structures (Through-hole, Blind, Buried, HDI, Stacked, Via-in-pad, Resin Filling, Conductive filling)

Ounces verses Mils in copper plating. Differences in inner-layer and outer layer requirements Cleanliness (ionic contamination, organic contamination and intermetallic growth)

Measurement Techniques for cleanliness (Gross IonAccumulation or Ionograph, Ion Chromatography, Resistivity of Solvent Extract

By continuing your navigation on this website, you accept the use of cookies to improve and personalize your navigation. For more information, please visit our Privacy Statement page or our use of cookies page to better manage your personal preferences. If you continue browsing our website, you accept the use of these cookies but you also have the option to refuse them and change your settings. To find out more about Cookies and to change the Cookies setting